Electronicdesign 23984 Octavosip Promo

The 100-Plus-Component C-SiP that Simplifies Board Design

Sept. 28, 2018
Octavo Systems has delivered a complete system-in-package (SiP) that includes timing and power management.

Over 100 components are packed into Octavo Systems’ complete system-in-package (C-SiP), a feat that would otherwise require them being designed into a custom circuit board. Replete with timing and power management, the OSD335x C-SiP only needs power and any peripheral sensors or controls that will be utilized by the module (see figure). The pinout for the C-SiP is designed to makes it very simple for designers to create carrier boards that are significantly easier to implement, including two- to four-layer boards.

The boards can often be half the size versus a non-SiP design. On the plus side, there’s no need for complex DDR layouts or implementing proper power sequencing. All of these are handled by the C-SiP. The SiP also incorporates most of the devices that would have issues with EMI, so there’s none to speak of.

The OSD335x C-SiP is based on TI’s AM335x SoC with a 1-GHz ARM Cortex-A8.

The system is based on Texas InstrumentsAM335x system-on-chip (SoC). This includes a 1-GHz ARM Cortex-A8 processor. The module also features 16 MB of eMMC flash memory, while main memory consists of 1 GB of DDR3. On top of that, there’s a 4-kB EEPROM. A TPS65217C PMIC handles power management, and the system uses a TL5209 that provides a 3.3-V output.

The system also includes all passives and the system oscillator. No off-chip components are required other than a power source. The C-SiP approach means developers have fewer parts to maintain. These would include any additional interfaces or peripherals needed for an application.

The C-SiP provides a wide range of interfaces, including a graphic system that supports 24-bit data and has a 3D graphics engine. It can handle active and passive LCD displays with or without touch interfaces. The analog side has an 8-channel, 12-bit SAR ADC. The AM335x maintains two programmable real-time unit industrial communication subsystems (PRU-ICSS). These can provide features like real-time network support.

Digital timing support includes enhanced PWMs and multiple timers. The enhanced quadrature encoders (eQEPs) and enhanced capture (eCAP) modules provide advanced motor and servo controls.

There are a range of serial interfaces, such as dual CAN 2.0 interfaces and a Gigabit Ethernet port with a two-port Ethernet switch.

The systems are available in commercial and industrial temperature versions. The C-SiP comes in a 27- by 27-mm, 400-ball module.

Sponsored Recommendations

The Importance of PCB Design in Consumer Products

April 25, 2024
Explore the importance of PCB design and how Fusion 360 can help your team react to evolving consumer demands.

PCB Design Mastery for Assembly & Fabrication

April 25, 2024
This guide explores PCB circuit board design, focusing on both Design For Assembly (DFA) and Design For Fabrication (DFab) perspectives.

What is Design Rule Checking in PCBs?

April 25, 2024
Explore the importance of Design Rule Checking (DRC) in manufacturing and how Autodesk Fusion 360 enhances the process.

Unlocking the Power of IoT Integration for Elevated PCB Designs

April 25, 2024
What does it take to add IoT into your product? What advantages does IoT have in PCB related projects? Read to find answers to your IoT design questions.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!