0320 Ed X Fab 180nm Soi On Bcd Web

X-FAB BCD-on-SOI Process Addresses Automotive Apps

March 19, 2020
The medium-voltage 180-nm devices developed with this technology could lead to more cost-effective products such as gate drivers and smart, integrated brushless dc motor drives.

With new medium-voltage transistors, X-FAB Silicon Foundries has rolled out a complement to its XT018 180-nm, BCD-on-SOI technology platform for automotive devices. The medium-voltage devices cover voltages from 12 to 32 V. Now, customers can access a complete portfolio of different voltage options from 10 to 200 V.

These new complementary NMOS/PMOS devices support automotive AEC-Q100 grade-0 designs and deliver competitive on-resistance (R(DS)on) figures combined with robust safe-operating areas for R(DS)on, IDSAT and VTH. Designs may be optimized for operational performance and size by selecting the most appropriate transistors. X-FAB’s XT018 technology is also touted as the only one that offers a full range of automotive grade-0 qualified memory options, including SONOS-based flash and embedded EEPROM. With these medium-voltage devices, engineers can design more cost-effective end products such as 100- and 200-V high-side gate drivers and smart, integrated brushless dc motor drives.

In addition to the availability of the new medium-voltage devices, X-FAB has begun full-volume production of the 70- to 125-V high-voltage transistors released last summer. These devices, which are mainly targeted at the growing market for automotive 48-V board net and battery-management-system (BMS) ICs, also can satisfy requirement in industrial and consumer applications.

BCD-on-SOI technology is superior in many aspects when compared to conventional bulk BCD technologies. Key advantages include virtual latch-up-free circuits, strong EMC resilience (due to complete isolation with buried oxide/DTI), lowest substrate coupling for fast switching dc-dc converters, and simplified handling of below-ground transients. Furthermore, through the potential for significant die-size reduction along with first-time-right implementation, it’s possible to accelerate development periods and achieve lower costs per die.

Contact X-FAB for more information on price and availability.

Sponsored Recommendations

What are the Important Considerations when Assessing Cobot Safety?

April 16, 2024
A review of the requirements of ISO/TS 15066 and how they fit in with ISO 10218-1 and 10218-2 a consideration the complexities of collaboration.

Wire & Cable Cutting Digi-Spool® Service

April 16, 2024
Explore DigiKey’s Digi-Spool® professional cutting service for efficient and precise wire and cable management. Custom-cut to your exact specifications for a variety of cable ...

DigiKey Factory Tomorrow Season 3: Sustainable Manufacturing

April 16, 2024
Industry 4.0 is helping manufacturers develop and integrate technologies such as AI, edge computing and connectivity for the factories of tomorrow. Learn more at DigiKey today...

Connectivity – The Backbone of Sustainable Automation

April 16, 2024
Advanced interfaces for signals, data, and electrical power are essential. They help save resources and costs when networking production equipment.


To join the conversation, and become an exclusive member of Electronic Design, create an account today!