High-Density Serial EEPROMs Reside In IndustryÕs Smallest Package

A new generation of 32 Kb and 64 Kb I2C serial EEPROMs are housed in a tiny, 8-lead MSOP package. Designed in the companyÕs advanced PMOS Electrically Erasable Cell (PEEC) process technology, these miniaturized versions of the 24LC32A and 24LC64 series extend the companyÕs 8-lead MSOP package offering with a wider range of densities from 128 bits through 64 Kb. According to the company, the package offers designers an unprecedented level of flexibility when implementing serial EEPROMs in space-constrained applications, making the devices an ideal choice for a wide range of portable, hand-held, telecommunications, computing and automotive designs. Targeted applications include consumer appliances, remote controls, medical devices, portable/personal electronics, PC peripherals, wearable PCs, pagers, security alarms and sensors. The 24LCXX features a low operating voltage down to 2.5V, active current of 1 mA and standby current of 1 µA. The 8-lead MSOP footprint is approximately 14.7 mm2 including the leads, which is 50% smaller than the popular 8-lead SOIC package and 23% smaller than an 8-lead TSSOP package. At 1.1 mm in height, the MSOP is also 29% lower in profile than the SOIC package. Pricing for the 24LC32A and 24LC64 is $0.42 and $0.49 each/10,000, respectively. MICROCHIP TECHNOLOGY INC., Chandler, AZ. (480) 792-7668.