Electronic Design
NAND BGA Package Houses Up To 16 GB

NAND BGA Package Houses Up To 16 GB

Accommodating 8-GB and 16-GB densities, the company’s high-density Single Level Cell (SLC) NAND solid-state storage solution consists of a single integrated plastic ball grid array (PBGA) package. Measuring 27 mm x 22 mm, the package offers a 63% space savings over standard CF cards of comparable density. The device supports various PATA interface protocols and an integrated 32-bit RISC flash controller manages wear leveling, error correction, and power interruption protection. Additionally, the PBGA package employs eutectic tin-lead solder balls on a 1.27-mm pitch with strategically placed signals to extend device life in harsh environments. MICROSEMI CORP., Irvine, CA. (800) 713-4113.

TAGS: Digital ICs
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