RFID Module Size Cut in Half

Aug. 13, 2009
The MAGICSTRAP RFID module from Murata is now half as thick—1.6 x 1.0 x 0.25mm. Its volume reduced by 89%, too, suiting the 2nd-gen module for paper label inlays targeted at retail applications.

Hoofddorp, Netherlands: The MAGICSTRAP RFID module from Murata is now half as thick—1.6 x 1.0 x 0.25mm. Its volume reduced by 89%, too, suiting the 2nd-gen module for paper label inlays targeted at retail applications.

MAGICSTRAP RFID modules can be mounted using ordinary adhesive onto most conductive surfaces to act as the antenna. It therefore represents an easy-to-implement “Zero Defect” tag solution that requires only minimal knowledge of RF electronics, says Murata.

Murata’s MAGICSTRAP RFID module combines the latest in ceramic materials with a breakthrough in inductive coupling technology to produce a durable and stable module. Each module comprises Murata’s LTCC (low temperature co-fired ceramic) substrate, plus RF IC and packaging. The company’s multi-layer ceramic knowledge enabled the embedding of all necessary RF circuitry within the LTCC substrate.

A typical RFID system for a paper tag inlay would be an antenna pattern of metal foil with a MAGICSTRAP module mounted on it. Due to its inductive-coupledconnection technology, it can be mounted using ordinary non-conductive adhesive.

The module’s embedded wideband antenna matching circuit allows MAGICSTRAP to be readable over the 860-960MHz band at a distance of up to 5m. This means the same module can be used worldwide, saving cost and inventory for manufacturers. MAGICSTRAP complies with EPC Global Class 1 Gen 2.

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