Dialog And TSMC Collaborate On BCD Process

Dialog And TSMC Collaborate On BCD Proces
March 16, 2010

Kirchheim and Teck, Germany, and Amsterdam, the Netherlands: Power semiconductor company Dialog Semiconductor and foundry partner Taiwan Semiconductor Manufacturing Company (TSMC) are working on a bipolar-CMOS-DMOS (BCD) technology tailored to high-performance power-management ICs for portable devices. The 0.25-µm high-voltage process node enables higher-voltage functionality to be integrated efficiently into single-chip power-management ICs (PMICs).

The ability to integrate higher voltage is a feature of Dialog’s next-generation PMICs. It enables the creation of smaller form-factor devices with reduced power consumption. A broad range of proprietary intellectual-property blocks, based on TSMC’s 0.25-µm BCD process nodes, has already been developed for incorporation into Dialog’s next-generation PMICs. The first devices are now available.
 

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