Path to Systems

This series explores challenges and solutions to the pace of integration and increased performance needed for tomorrow’s embedded applications, and how system-in-package fits into it all.

This article series is in the System Design section of our Series Library

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Creating systems using the latest technology can be a challenge because it often takes advantage of the circuit board technology, high-speed communication, and advanced power management. Developers can become familiar with all of these aspects and design a board and system or they can let someone else handle the heavy lifting by using a system-in-package (SIP).

A custom circuit board is still needed, but the SIP provides a simplified interface making that board design easier. The board is often simpler with fewer layers because the SIP handles that complexity. This series examines issues, approaches, and advantages of SIP technology for embedded developers.