EE Product News

Northbrook, IL

Northbrook, IL-The findings of a three-year investigation into the use of BGA packaging for space flight applications has been released by the Interconnection Technology Research Institute (ITRI). The Ball Grid Array Packaging Guidelines Report describes the rationale behind the project, the formation of the design of experiment (DOE) test matrix, the design and fabrication of test vehicles, and the results and lessons learned from implementation of the DOE. The reports also include analysis of the results of environmental stressing and predictions of cycles to failure based on Weibull plots. Copies of the report are free to ITRI members and are $250 for non-ITRI members.

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