ASMC 2016 to address semiconductor industry realities and opportunities

Feb. 25, 2016

San Jose, CA. The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2016) will be held May 16-19 in Saratoga Springs, NY. The conference will feature 35 hours of technical presentations and over 100 experts covering all aspects of advanced semiconductor manufacturing. This year’s event features a panel discussion on “Moore’s Law…Wall vs. Wallet…Where Do We Grow from Here?” and a tutorial on nanoscale III-V CMOS by Dr. Jesús A. del Alamo, director, Microsystems Technology Laboratories, MIT.

SEMI’s ASMC continues to provide a venue for industry professionals to network, learn, and share knowledge on new and best-method semiconductor manufacturing practices and concepts. The conference is co-chaired by Dr. Jeanne Bickford of GLOBALFOUNDRIES and Dr. Janay Camp of KLA-Tencor. ASMC 2016 offers keynotes by Christine Furstoss, VP and technical director, Manufacturing & Materials Technologies, GE Global Research, on “Advanced Manufacturing…Changing Today’s Paradigm,” and by Robert Maire, president, Semiconductor Advisors, on “Is China Driving the Urge to Merge?”

The topical areas that ASMC 2016 will address include

  • 3D/TSV,
  • advanced equipment and materials processes,
  • advanced metrology,
  • advanced patterning,
  • advanced process control (APC),
  • contamination free manufacturing (CFM),
  • yield management and defect inspection,
  • equipment reliability and productivity enhancement, and
  • factory optimization.

ASMC includes an interactive poster session and reception, which provides an opportunity for networking between authors and conference attendees.

ASMC 2016 is presented by SEMI along with technical sponsors: Institute of Electrical & Electronics Engineers (IEEE), IEEE Electron Devices Society (EDS), and IEEE Components, Packaging and Manufacturing Technology Society (CPMT). Corporate sponsors include Air Liquide, Applied Materials, Applied Seals, Edwards, FEI, Greene Tweed, JT Baker-Avantor, KLA-Tencor, Nikon, and Valqua America.

www.semi.org/asmc

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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