Nice, France. Paul Lindner, executive technology director at EV Group, is the recipient of the 2015 European SEMI Award. Since 1989, the European SEMI Award has been presented to the person or team that made significant contributions to the European semiconductor and related industries. This award, an industry honor for Lindner, was presented at the SEMI Industry Strategy Symposium Europe 2016 conference held in Nice March 6–8.
Lindner was nominated and selected by his peers within the international semiconductor community in recognition of his outstanding contributions in the field of wafer processing equipment. Lindner led innovations in wafer bonding technologies at EV Group (EVG). The process separation between wafer alignment and wafer bonding, developed in 1990, revolutionized wafer bonding technology and has since become an industry standard. Lindner changed the way the industry builds semiconductors. Lindner exemplifies EVG’s ongoing effort of “being the first” in exploring new techniques and serving next-generation applications of micro- and nano-fabrication technologies.
“We are very proud of SEMI Member EVG’s achievements in wafer bonding technologies and the contributions that Paul Lindner and his team have made to the semiconductor community,” said SEMI Europe president Laith Altimime.
Lindner heads the R&D, product and project management, quality management, business development and process technology departments at EVG Group. He joined EVG in 1988 as a mechanical design engineer and has since pioneered semiconductor and MEMS processing systems, which have set industry standards.
The European SEMI Award was established more than two decades ago to recognize individuals and teams who have made a significant contribution to the European semiconductor and related industries.
