Sensor technology to be examined at SEMI European MEMS Summit

April 29, 2016

Grenoble, France. SEMI has announced the second annual edition of the SEMI European MEMS Summit, dedicated to MEMS and sensors, to be held on September 15-16. After a successful inaugural event in Milan that attracted 265 attendees, this year’s SEMI European MEMS Summit will convene in Stuttgart, one of the world’s major MEMS and Sensor hubs.

MEMS volumes are expected to nearly double, compared to today’s levels, and reach 30 billion units by 2020, based on a Yole Développement forecast. While the growth is impressive, challenges exist, and through the SEMI European MEMS Summit’s unique combination of plenary executive talks, exhibition, and networking opportunities, major issues will be addressed for discussion and collaboration:

  • making sensors smaller, smarter, and cheaper;
  • emerging technologies and readiness, maturity;
  • price and margin pressures and business models; and
  • market dynamics and new opportunities.

In addition, leading companies will share key messages on their product and business strategic development. Sessions will focus on automotive, consumer electronics and wearables, Internet of Things (IoT), and more.

“Stuttgart is the ideal location for the 2016 SEMI European MEMS Summit, and we look forward to exchanging views on the latest advances in the MEMS industry,” said Klaus Meder, president of Automotive Electronics at Robert Bosch GmbH.

The conference program is developed by a steering committee composed of industry and thought leaders including ASE, Bosch, Bosch Sensortec, CEA-Leti, EV Group, Fraunhofer ENAS, Fraunhofer IZM, IHS, NXP, Okmetic, Sencio, SPTS, STMicroelectronics, SUSS MicroTec, X-Fab, and Yole Développement. The program will feature executive speakers from organizations shaping the industry and will be announced in late spring.

Registration for the conference, exhibition and sponsorship packages are open for bookings with early bird prices valid until May 31.

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