Sensors Expo & Conference convenes June 21 in San Jose, with the exhibition scheduled for June 22-23. The event will build on last year’s edition in Long Beach, CA, and mark the event’s second appearance on the West Coast.
The three-day program explores cutting-edge trends and applications including energy harvesting, flexible and wearable technologies, IoT, measurement and detection, MEMS and sensors, novel sensor applications, optics, sensors and embedded systems design, and wireless technology.*
Several exhibitors have indicated their plans for the exposition. Distributor Mouser Electronics Inc. said it will showcase some of the newest sensor technologies from its manufacturer partners, Amphenol, Analog Devices, Bosch, Broadcom, Fairchild, Intel, Microchip, Nordic, NXP, Rohm Semiconductor, Seeed, Sensirion, TE Connectivity, and Texas Instruments. Mouser representatives will be on hand to discuss the newest sensor products from those companies and will offer a live demonstration of the new Hexiwear Wearable Development Kit, developed by MikroElektronika. Engineers can also find more information about Mouser’s Empowering Innovation Together program.
Distributor Digi-Key will highlight its sensor selector. Visually organized by sensor type, the sensor selector has the “feel” of classic catalog organization with quick navigation and easy purchasing. Product sections include inertial, motion, and position measurement; temperature sensors; pressure sensors and transducers; and capacitive touch/proximity sensors.
NXP will present two sessions introducing its Sensor Toolbox and IoT Sensing SDK. Attendees of these sessions will be able to visualize sensor data from NXP sensors via the new Sensor Toolbox Community Edition. Attendees will also learn how ISSDK integrates with NXP’s Kinetis SDK to bring a sensor framework into an embedded environment and how to create a sensor data logger using NXP’s Freedom platform.
TE Connectivity will offer live, hands-on demonstrations highlighting piezo film tracking movements, submersible accelerometers, and digital component sensors. On Tuesday, TE Connectivity engineer, Richard Brown present on the “Theory and Applications of Piezo Film for Sensors and Energy Harvesters.” Copies of the presentation will also be available at the TE booth.
In addition, Innovative Sensor Technology IST USA will highlight thin-film platinum and nickel RTD temperature sensors, capacitive humidity sensors, mass flow sensors, conductivity sensors, and biosensors at the component level. Bosch will offer presentations on its MEMS sensors. MASSA will exhibit its ultrasonic sensors for measuring chemicals, fluids, turbulence, solids, and uneven surfaces.
Finally, the WISE [Women in Sensor Engineering] Breakfast is scheduled for Thursday at 7:30 a.m. Speakers include Margit Harting, director, PST Sensors; Susana Cardoso de Freitas, Ph.D., senior researcher, INESC Microsystems & Nanotechnologies; Jessica Gomez, founder and CEO, Rogue Valley Microdevices, Inc.; Mary Ann Maher, CEO and founder, SoftMEMS; and Petrina Zaraszczak, director, Industrial Vertical Market, Sensor Solutions, TE Connectivity.
Visit http://www.sensorsexpo.com/ for more information.
*“Sensors Expo convenes June 21 in San Jose,” EE-Evaluation Engineering, May 2016, p. 6.
