Smoltek to represent nanotechnology at MEPTEC symposium

Nov. 10, 2016

On November 14 in San Jose, the trade association MEPTEC (MicroElectronics Packaging and Test Engineering Council) will gather important actors in the semiconductor packaging industry at its 2016 Semiconductor Packaging Roadmap Symposium. Among them, the Swedish nanotechnology company Smoltek will represent nanotechnology as a substantial option for the future of semiconductors.

Nanotechnology is one of the possible solutions to one of the biggest challenges the electronic industry is facing at the moment, the end of Moore’s law. By using nanotechnologies instead of today’s technologies, the capacity of electronic components can be significantly increased. Smoltek is a privately held company that specializes in the development of nanostructure fabrication technology to solve advanced materials engineering problems. Smoltek has developed a proprietary nanostructure technology platform that enables the formation of nanostructures optimized for advanced semiconductor packaging applications.

With its research, the company has managed to reduce the growth temperature for conductive carbon nanostructures to below 390°C. This patented technology enables the semiconductor industry to integrate such nanostructures for applications such as solid state capacitors, ultrafine pitch interconnects and thermal management to support continued miniaturization and increased performance. This offers a disruptive technological shift that can change the entire game plan.

MEPTEC is a trade association of semiconductor suppliers, manufacturers, and vendors concerned exclusively with packaging, assembly, and test. As a gold sponsor for the event, Smoltek will present its technology using carbon nanostructures as an assembly platform for the next wave of semiconductor advanced packaging.

“Smoltek appreciates MEPTEC’s engagement in the semiconductor packaging Heterogeneous Integration Roadmap.” said Anders Johansson, CEO of Smoltek. “We anticipate this to be a perfect event for relevant exposure of our cutting edge SMOLTEK Tiger assembly platform facilitated by conductive nanostructures.”

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