Munich, Germany. SEMICON Europa 2017 will take place in Munich for the first time, co-located with productronica, November 14-17. SEMICON Europa will showcase the critical issues shaping the entire electronics manufacturing supply chain. Executive keynoters will share their thought leadership on current opportunities for Europe: Maria Marced, president, TSMC Europe; Stefan Finkbeiner, CEO, Bosch Sensortec; and Frank M. Rinderknecht, founder and CEO of Rinspeed Inc.
“Innovations in semiconductor manufacturing are at the heart of the value chain driving innovations enabling key future growth drivers in mobile, automotive, medical, passive and intelligent computing as well as AR and VR,” stated Laith Altimime, president, SEMI Europe. SEMICON Europa programs, sessions, and speakers will illuminate this year’s theme, “Empowering Innovation and Shaping the Value Chain.”
Highlights of SEMICON Europa include the Fab Management Forum, Advanced Packaging Conference, the Power Electronics Conference, the Materials Conference, and the European Connect2Car Forum.
In addition, a collaborative effort between FLEX and Fraunhofer EMFT will offer insights on innovative solutions for flexible and stretchable systems.
SEMICON Europa 2017, co-located with productronica, will take place on November 14-17, 2017 at Messe München, Munich, Germany.