BGA Modules Boost Bandwidth Efficiency

Designed for easy integration into base-station MCPA applications, the VM series of vector modulator modules is said to increase bandwidth efficiency and high-speed data transmission for 2.5G systems. Consisting of eight chips integrated into a BGA module, they offer 360° of phase control and a wide, linear amplitude adjustment range.
Multi-chip module packaging allows mixed technologies to be integrated inside the same packaging, thereby delivering high performance products that cover AMPS through WCDMA applications. Typical performance characteristics include an insertion loss of 40 dB.