Transmitter Chips Claim To Reduce Component Count

    Sept. 1, 2000
    The MAX2360, 2362 and 2364 baseband-to-PA, dual-band cellular phone transmitter ICs feature a high level of integration, which, it is claimed, dramatically reduces component count and size. The MAX2360 includes an I/Q modulator, IF VGA, dual IF VCOs,

    The MAX2360, 2362 and 2364 baseband-to-PA, dual-band cellular phone transmitter ICs feature a high level of integration, which, it is claimed, dramatically reduces component count and size. The MAX2360 includes an I/Q modulator, IF VGA, dual IF VCOs, triple synthesizers, upconverters, RF VGA, and three RF power amplifier drivers. Its linear output power of +7 dBm allows the power amplifier to be driven directly, eliminating two saw filters and two external PA drivers. The MAX2360 fits a variety of applications such as CDMA, TDMA, and EDGE dual-band phones. The MAX2362 is suited to single-band PCS and W-CDMA, and the MAX 2364 is suited to single-band, dual-mode cellular applications. The devices are available in a 48-pin TQFP and prices start at $5.85 each/1000.

    Company: MAXIM INTEGRATED PRODUCTS INC.

    Product URL: Click here for more information

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