SMT MCM Reduces Datacomm Equipment Costs

Claiming to dramatically reduce the cost of manufacturing high-speed and high-frequency data communications equipment, the Alpha-2 module uses a proprietary multi-chip packaging technology to replace labor- and capital-intensive wire-bonding solutions. The MCM is also said to be the industry's first surface-mounted package specifically designed for high-frequency and high-speed ICs. It is well-suited for use in LMDS wireless systems, OC-192, and future OC-768 fiber-optic systems. A number of different components are available in Alpha-2 packages, including the AA028P2-A2 25- to 32-GHz driver. This device is priced at $7.74 each/100,000.