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Electronic Design UPDATE e-Newsletter 
Electronic Design Magazine 
http://www.planetee.com April 9, 2003 
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  Today's Table of Contents: 
1. Editor's View -- Commentary 
2. News -- From The Editors 
3. Upcoming Industry Events 
4. Magazine Highlights     
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1. Editor's View -- Exclusive to Electronic Design UPDATE 
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Micro Fuel Cells Get Ready To Power Up By Ron Schneiderman, Professional /Careers Editor 
   Want the battery in your cell phone or PDA to last forever? Okay,  how about 10 times longer than your current battery? Developers of  fuel cells for these "micro" devices believe they have the potential  to offer about 10 times the energy density of current lithium battery  technologies, which means a lot more runtime for mobile computing and  communications products.    Most of the more than 30 companies active in this area haven't said  much about their plans in the past two years, presumably for competitive  reasons. But market analysts who follow this technology expect it to  begin to show up as an option for some laptop and notebook computers,  as well as cell phones and PDAs, by the end of this year, led by Toshiba,  Samsung, NEC, and Sanyo. (Intel's venture capital group has invested in  two U.S.-based companies, PolyFuel and Neah Power Systems, and Intel  demonstrated a fuel-cell-powered laptop at its developers conference in  February.)    Initially, because of their size, these fuel cells probably won't be  fully integrated into the devices they're designed to power. More  likely, they will be outboard accessories. But they will be designed  for a specific product. For example, the first fuel cells designed for  PDAs will probably be about the same size and form factor as the  handheld units, but they will clip on to the handheld devices. Yes,  they will add weight and cost. But like any other portable consumer  electronic product, they're expected to start dropping in weight and  price almost as soon as they enter the market.    Currently, there are three major fuel-cell types for portable electronic  products.  One is direct-methanol fuel cells (DMFCs). Another is  proton-exchange membrane fuel cells (PEMs). Then, there are metal-air  fuel cells. It's still not clear which one is going to "win" in terms  of market share--that is, which one will be the smallest, lightest,  and cheapest, all at once in the early going. Indeed, one of the most  important tasks for micro fuel-cell developers is to miniaturize their  products as quickly as they can. (Chip-based fuel cells are being predicted  by as early as the end of 2005.)    Clearly, the market potential is huge. Just add up all of the portable  computers, PDAs, cell phones, camcorders, electric handtools, MP3  units, and everything else you can think of over the next few years  that could use these fuel cells. Huge! 
Contact Ron Schneiderman at: mailto:[email protected] 
To discuss this article, go to  http://lists.planetee.com/cgi-bin3/flo/y/eQP10Gl4E70EmQ08hP0AB 
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2. News -- From The Editors 
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QAM/QPSK Demodulator Includes AGC Capability In addition to the usual I/Q mixers, the AD8348 quadrature demodulator  features a variable-gain IF amplifier to implement automatic gain control  (AGC). The amplifier's linear-in-dB AGC range is 45 dB. The IC's IF input  is differential and can span 50 to 1000 MHz. The local oscillator input  may be as high as 2 GHz. The mixers are Gilbert cells with 0.6-degree  phase accuracy and 0.3-dB amplitude balance. The third-order intercept  is +26-dBm minimum and -7-dBm maximum at 450 MHz. The mixers connect to  differential output amplifiers designed to interface directly to  analog-to-digital converters for digitizing and baseband post-processing.  Available in a 28-pin TSSOP package, the device runs on a single 2.7- to  5.5-V supply. For more information, go to  http://lists.planetee.com/cgi-bin3/flo/y/eQP10Gl4E70EmQ05Tq0AL 
***Ultra-Wideband Personal-Area Networks Advance At a recent meeting of the IEEE 802.15.3a task force, Focus Enhancements'  Semiconductor Group presented a promising technique for implementing the  new standard's ultra-wideband (UWB) personal-area network (PAN). The  approach uses a modified orthogonal frequency-division-multiplexing (OFDM)  technique that divides the standard's 7.5 GHz of bandwidth into five  bands or bins over which the data is spread. Each bin is modulated to  the max. Combined, they provide maximum power over the total band to  deliver a UWB speed of 200 Mbits/s up to 25 meters and 480 Mbits/s over  four meters. The task force presented 23 different approaches that might  be used to implement a UWB PAN, which was approved by the Federal  Communications Commission in February 2002 for use in the 3.1- to 10.6-GHz  range at a power level of -41 dBm/meter. The IEEE hopes to establish a  standard with a target performance of 110 Mbits/s over 10 meters, 200  Mbits/s over four meters, and 480 Mbits/s at less than four meters.  For more information, visit Focus’ Web site at  http://lists.planetee.com/cgi-bin3/flo/y/eQP10Gl4E70EmQ08hA0Au 
***Flash Disk Adds Data Security Features M-Systems has enhanced the security features on its IDE- and SCSI-based  fast flash-disk products. The line now incorporates a data-sanitize  procedure and selective and auto-resume quick security-erase capabilities. With these features, users can purge (erase)  confidential data from flash memories within rigid standards set down by  the Department of Defense, National Security Agency, Air Force, Army, and  Navy. The security-erase feature erases all data in seconds, or it can be  used selectively, erasing only a portion of the flash disk. This  partial-erase capability lets customers purge confidential data only,  so the flash disk can be immediately reloaded with new mission data. The  auto-resume capability guarantees the automatic erasure of sensitive data,  even if power is unstable or completely lost. Once power returns, the disk  will automatically continue the erase procedure. For more information,  go to  http://lists.planetee.com/cgi-bin3/flo/y/eQP10Gl4E70EmQ08hB0Av 
***Mega-Merger Produces Semiconductor Powerhouse Two of the largest Japanese semiconductor manufacturers will combine most  of their product lines to form a new company, Renasas Technology Corp.,  which will control all the R&D, product definition, manufacturing, and  marketing for a broad range of devices. Headquartered in Tokyo, Renasas  will integrate multiple product families from Mitsubishi and Hitachi,  including flash memory, SRAMs, microcontrollers, ASICs, and  application-specific standard products. Hitachi will also add its  IC-card products, its RF modules, and its mixed-signal products to the  new company. However, Mitsubishi has sold its DRAM product line to Elpida,  the company formed by the consolidation of DRAM product lines from several  Japanese suppliers. Additionally, Mitsubishi will retain control of its  optoelectronic products, its high-frequency RF devices, and its power  devices. For more information, check out  http://lists.planetee.com/cgi-bin3/flo/y/eQP10Gl4E70EmQ08hC0Aw 
***x86 Competition To Continue... At Least For A Few Years VIA and Intel have settled their host of patent infringement cases. Under  terms of the settlement, both companies entered into a 10-year patent  cross-license agreement covering each other's products. VIA can create  and sell processors that are instruction-set compatible but not pin- or  bus-compatible with Intel processors. VIA received a four-year license  to design and sell chip sets that are compatible with the Intel  microprocessor bus. 
***CORRECTION In the March 26 UPDATE, an incorrect link was provided for the Eclipse  Consortium. The correct location is  http://lists.planetee.com/cgi-bin3/flo/y/eQP10Gl4E70EmQ08hD0Ax 
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 3. Upcoming Industry Events 
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April 22-24, Third International Conference on Lead-Free Components and Assemblies, Fairmont Hotel, San Jose, Calif. Jointly sponsored by IPC  and JEDEC, this conference offers technical presentations, tutorials,  guest speakers, and educational classes.  http://lists.planetee.com/cgi-bin3/flo/y/eQP10Gl4E70EmQ08CH0AQ  or  http://lists.planetee.com/cgi-bin3/flo/y/eQP10Gl4E70EmQ08CI0AR 
April 22-26, Embedded Systems Conference, San Francisco, Calif. This show  will present more than 140 conference sessions, including tracks  concentrating on system-on-a-chip designs and consumer electronics.  Topics will include security, Wi-Fi, audio and video, Linux, and real-time  design.  http://lists.planetee.com/cgi-bin3/flo/y/eQP10Gl4E70EmQ08CJ0AS 
April 23-24, Military and Aerospace Electronics East Show with COTScon,  Baltimore, Md.  http://lists.planetee.com/cgi-bin3/flo/y/eQP10Gl4E70EmQ08CK0AT  or call (603) 891-9267. 
April 27-May 2, Networld + Interop, Las Vegas, Nev. One of the largest  networking conferences and expositions of the year will feature workshops  and testing lab demonstrations.  http://lists.planetee.com/cgi-bin3/flo/y/eQP10Gl4E70EmQ08Se0AB 
May 11-13, NanoBusiness Spring, New York Marriott Financial Center,  New York. Produced in association with the NanoBusiness Alliance, the  show will feature presentations, demonstrations, networking, and business  deals covering the emerging business of microsystems and nanaotechnology.  http://www.nanobusiness.org 
May 27-30, 53rd Electronic Components Technology Conferfence,  New Orleans, La. Organized by the IEEE/CPMT  ( http://lists.planetee.com/cgi-bin3/flo/y/eQP10Gl4E70EmQ08CR0Aa ),  the conference focuses on electronic components,with a concentration  on packaging.  It includes sessions on optical and fiber-optic  components.  http://lists.planetee.com/cgi-bin3/flo/y/eQP10Gl4E70EmQ08CM0AV  
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4. Magazine Highlights 
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In case you missed them, here are some of the high points of our most  recent issue, March 31, 2003. 
  * Cover Feature -- Success Story: Automotive Electronics -- OnStar  System Puts Telematics On The Map Millions of drivers now take advantage  of this interactive automotive security, convenience, and  roadside-assistance infrastructure. 
 * Leapfrog: Industry First -- Cost-Savvy DSP Chip Trio Keeps Peformance  High Second generation of Blackfin low-power processors targets converging multimedia and communications. 
 * Design View -- Troubleshoot High-Speed Buses By Clearing "Clock Scheme  Fog" High-speed digital buses continuously evolve. Not only are they  faster, they're also changing how a system clocks data. 
 For the complete Table of Contents, go to   http://lists.planetee.com/cgi-bin3/flo/y/ePk30GmPTq0EmQ07xN0AY 
==================================
SPONSORED BY: MICROCHIP
Today's Table of Contents:
1. Editor's View -- Commentary
2. News -- From The Editors
3. Upcoming Industry Events
4. Magazine Highlights
**********************
1. Editor's View -- Exclusive to Electronic Design UPDATE
**********************
Micro Fuel Cells Get Ready To Power Up By Ron Schneiderman, Professional /Careers Editor
2. News -- From The Editors
**********************
QAM/QPSK Demodulator Includes AGC Capability In addition to the usual I/Q mixers, the AD8348 quadrature demodulator features a variable-gain IF amplifier to implement automatic gain control (AGC). The amplifier's linear-in-dB AGC range is 45 dB. The IC's IF input is differential and can span 50 to 1000 MHz. The local oscillator input may be as high as 2 GHz. The mixers are Gilbert cells with 0.6-degree phase accuracy and 0.3-dB amplitude balance. The third-order intercept is +26-dBm minimum and -7-dBm maximum at 450 MHz. The mixers connect to differential output amplifiers designed to interface directly to analog-to-digital converters for digitizing and baseband post-processing. Available in a 28-pin TSSOP package, the device runs on a single 2.7- to 5.5-V supply. For more information, go to http://lists.planetee.com/cgi-bin3/flo/y/eQP10Gl4E70EmQ05Tq0AL
3. Upcoming Industry Events
**********************
4. Magazine Highlights
**********************
In case you missed them, here are some of the high points of our most recent issue, March 31, 2003.