Bluetooth Multi-Chip Module 70% Smaller Than Predecessor

Nov. 1, 2002
Built 70% smaller than its predecessor, the ROK104001 Bluetooth multi-chip module has been developed to speed time-to-market by enabling designers to quickly implement qualified and tested Bluetooth products in comparison to starting with a chipset.

Built 70% smaller than its predecessor, the ROK104001 Bluetooth multi-chip module has been developed to speed time-to-market by enabling designers to quickly implement qualified and tested Bluetooth products in comparison to starting with a chipset. No RF design knowledge is reportedly required to integrate the module into new products. The module includes a baseband with internal flash memory, a radio transceiver, a reference crystal, and host controller, interface-level embedded software. The flash memory comes in either 4 Mb or 8 Mb capacities. The ROK104001 module also features Class 2 output power and can drive up to seven slave units. It is suited for both embedded and host-based applications, where designers require an antenna to complete a full Bluetooth design. Ideal for use in space-sensitive portable electronic wireless applications, such as headsets, PC cards, compact flash cards, mobile phones and PDAs, the modules have a starting price of $14.40 each in high volume. ERICSSON MICROELECTRONICS AB, Richardson, TX. (877) 374-2642.

Company: ERICSSON MICROELECTRONICS AB

Product URL: Click here for more information

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