Representing a single-mode W-CDMA solution, this chipset includes a power amplifier, low noise amplifier, mixer, IF amplifier/demodulator, modulator/IF amplifier, upconverter, and PA driver functions. The chipset offers a complete RF-to-IF solution for W-CDMA using HBT, SiGe and BiCMOS process technologies. Intended to meet the demands for 3G apps, the ICs use small leadless packages, have low power consumption, and are compatible with ARIB and ETSI for IMT-2000.