Next Gen COMM IC Employs 0.15 µm CMOS Process

Sept. 1, 2002
The company's next-generation HomePlug 1.0 power line communications integrated circuit, the INT51X1, is manufactured on UMC's 0.15 µm CMOS process technology. The chip employs several IP resources to integrate USB 1.1, Ethernet and MII

The company's next-generation HomePlug 1.0 power line communications integrated circuit, the INT51X1, is manufactured on UMC's 0.15 µm CMOS process technology. The chip employs several IP resources to integrate USB 1.1, Ethernet and MII interfaces, and the a/d and d/a converters and AGC controller in system-on-chip (SOC) design. The device allows networked consumer and business products to communicate over existing power lines at speeds up to 14 Mb/s. It also allows users to share Internet access and connect computers and other devices by plugging into power outlets. Samples of the INT51X are available now. For further details, contact INTELLON CORP., Ocala, FL. (352) 237-7416.

Company: INTELLON CORP.

Product URL: Click here for more information

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