Pan-European project addresses cyber-physical systems for IoT

March 30, 2015

CEA-Leti, coordinator of the pan-European consortium EuroCPS, announced that the 15 partners have set up the goals of their collaborative project to establish a network of design centers to help SMEs and large companies develop innovative products for emerging Internet of Things (IoT) markets. The group will use proven cyber-physical system (CPS) platforms and working with research technology organizations (RTOs) or technology-transfer-oriented university institutes who cluster a wide spectrum of technical and application knowledge to support innovation.

Funded by the European Commission, the three-year, €9.2 million project is designed to help innovators (SMEs and large companies) overcome barriers they face when entering new markets because they lack both knowledge of the value chain and the skills to master the entire design process from ideas to products. To that end, EuroCPS partners will provide technical expertise, coaching, and access to advanced industrial CPS platforms to get innovators up to speed on the innovation ecosystem of smart products by facilitating access to the latest technologies and their implementation. In the process, it will offer all the necessary expertise and competencies to provide innovators from any sector with a smooth path to building innovative CPS-enabled systems. It also will tap existing regional ecosystems in several countries to bring the full value chain–from hardware/software platforms to cyber-physical systems–to high value-added products and services.

“EuroCPS will create synergies between emerging and established organizations operating in the CPS sector,” said Marie-Noëlle Semeria, CEO of Leti. “From that foundation, it will leverage the existing ecosystem to bring the full value chain from microelectronics, smart systems, and CPS to high value-added products and services. This combination will centralize in one project all the necessary expertise and competencies to provide SMEs from any sector with a one-stop-shop opportunity to build innovative CPS-enabled systems.”

As information and communications technology becomes increasingly integrated into our everyday environment, the design of embedded ICT from components to CPS becomes more important than ever, not only for the ICT supply industry but also for all major mainstream sectors of the economy. Embedded systems and more particularly CPS are key enablers of innovation in European industry, and SMEs are the primary drivers of job creation. By integrating SMEs into the CPS sector and helping them develop innovative products more rapidly, EuroCPS is expected to foster job growth and create sustained demand for European manufacturing, especially as the IoT creates demand for new products.

One key goal of the project is to link software, system and nanoelectronic industries along the full CPS value chain to demonstrate a new cooperation model. This will be demonstrated by 30 novel industrial experiments funded through three open calls for developing innovative CPS products that will help increase the competitiveness of the European innovative companies. The targeted products will be designed, constructed, and built on the EuroCPS Platforms:

  • avionics platform provided by Thales,
  • connectivity platform provided by Schneider,
  • INEMO platform provided by STMicroelectronics,
  • integrated and open platform provided by AVL,
  • power management platform provided by Infineon,
  • Quark platform provided by Intel,
  • silicon processes and package technology platform provided by STMicroelectronics, and
  • STM32F platform provided by STMicroelectronics.

EuroCPS members are major European system suppliers, world-class research centers, and technology providers, all rooted in the top European regional ecosystems. Based on this strong foundation in European and national initiatives, EuroCPS will significantly reduce development time and certification efforts, thus putting Europe at the cutting edge of CPS development and implementation. It will do this through pan-European collaboration and knowledge exchange and access to the strong value chain in the strategic sector.

EuroCPS Project members include

  • CEA-Leti (coordinator, France),
  • CEA-List (France),
  • STMicroelectronics Grenoble 2 SAS (France),
  • Thales SA (France),
  • AVL LIST GmbH (Austria),
  • Infineon Technologies Austria AG (Austria),
  • Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung E.V. (Germany),
  • The Digital Catapult (UK),
  • Alma Mater Studiorum–University of Bologna (Italy),
  • Lulea Tekniska Universitet (Lithuania),
  • Budapesti Muszaki es Gazdasagtudomanyi Egyetem (Hungary),
  • Intel Shannon Limited (Ireland),
  • Schneider Electric Industries SAS (France),
  • Vereniging High Tech NL (The Netherlands),
  • Finepower GmbH (Germany), and
  • STMicroelectronics SRL (Italy).

EuroCPS is part of the Smart-Anything-Everywhere Initiative under Horizon 2020 Leadership in Enabling Industrial Technologies, which aims to generate new and breakthrough technologies, boost competitiveness, create jobs, and support growth by offering a European-wide network of design centers. A first group of four innovation actions will combine efforts under the 25M€ funding budget to support around 100 industrial experiments with the aim of involving more than 200 SMEs and midcaps in the field of cyber-physical systems (CPS), Internet of Things (IoT), and smart systems integration (SSI).

www.eurocps.org

www.leti.fr

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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