AI Platform Offers Scalable, Efficient On-Device Edge AI Processing

March 29, 2023
The Cadence Tensilica AI Platform delivers scalable and energy-efficient on-device to edge AI processing.

Check out more of our Embedded World 2023 coverage. This video is also part of the TechXchange: AI on the Edge.

Addressing the creation of artificial-intelligence-oriented system-on-chip (SoC) designs, Cadence Design Systems' Tensilica AI Platform helps empower AI device development. And supporting product families are optimized for varying data and on-device AI requirements.

It delivers scalable and energy-efficient on-device support for edge AI processing, with an energy-efficient companion AI neural-network engine and neural-network accelerators in a turnkey solution. These solutions support intelligent sensor, audio, vision, voice, and advanced driver-assistance systems (ADAS) applications, delivering optimal power, performance and area, as well as scalability, using a common software platform.

Related links:

Sponsored Recommendations

The Importance of PCB Design in Consumer Products

April 25, 2024
Explore the importance of PCB design and how Fusion 360 can help your team react to evolving consumer demands.

PCB Design Mastery for Assembly & Fabrication

April 25, 2024
This guide explores PCB circuit board design, focusing on both Design For Assembly (DFA) and Design For Fabrication (DFab) perspectives.

Unlocking the Power of IoT Integration for Elevated PCB Designs

April 25, 2024
What does it take to add IoT into your product? What advantages does IoT have in PCB related projects? Read to find answers to your IoT design questions.

Near- and Far-Field Measurements

April 16, 2024
In this comprehensive application note, we delve into the methods of measuring the transmission (or reception) pattern, a key determinant of antenna gain, using a vector network...

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!