Low-Profile Coolers Work On Intel And AMD Microprocessors

Sept. 1, 2000
The LP500 series of low-profile, micro-cold forged coolers is designed to cool both Intel and AMD microprocessors. The series is also designed to surpass the microprocessor manufacturers' acceptable heat dissipation criteria for devices that include:

The LP500 series of low-profile, micro-cold forged coolers is designed to cool both Intel and AMD microprocessors. The series is also designed to surpass the microprocessor manufacturers' acceptable heat dissipation criteria for devices that include: Intel Celeron PPGA and Flip Chip from 533 to 700 MHz; Coppermine to 933 MHz; and AMD Duron to 700 MHz. The heatsinks use either 50 x 10 mm or 60 x 12 mm coreless fans that provide 50,000 hr. MTBF.

Company: COFAN USA

Product URL: Click here for more information

Sponsored Recommendations

The Importance of PCB Design in Consumer Products

April 25, 2024
Explore the importance of PCB design and how Fusion 360 can help your team react to evolving consumer demands.

PCB Design Mastery for Assembly & Fabrication

April 25, 2024
This guide explores PCB circuit board design, focusing on both Design For Assembly (DFA) and Design For Fabrication (DFab) perspectives.

What is Design Rule Checking in PCBs?

April 25, 2024
Explore the importance of Design Rule Checking (DRC) in manufacturing and how Autodesk Fusion 360 enhances the process.

Unlocking the Power of IoT Integration for Elevated PCB Designs

April 25, 2024
What does it take to add IoT into your product? What advantages does IoT have in PCB related projects? Read to find answers to your IoT design questions.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!