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    LTCC Ceramic Substrates Stop Heat Buildup

    Nov. 9, 2004
    Ceramic substrates with mini cooling tunnels combined with LTCC (low temperature co-fired ceramic) construction can dissipate heat in critical component applications. The thick-film printing and ceramic substrate processes produce a

    Ceramic substrates with mini cooling tunnels combined with LTCC (low temperature co-fired ceramic) construction can dissipate heat in critical component applications. The thick-film printing and ceramic substrate processes produce a temperature-controlled package. The cooling tunnels built into the substrate draw heat away from the critical components with or without forced-air cooling. MINICAPS INC., Mission Viejo, CA. (949) 305-8126.

    Company: MINICAPS INC.

    Product URL: Click here for more information

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