Components: Thin-Film Wire-Bond Resistor Chips Handle High Power Levels

Nov. 24, 2003

Though measuring 0.030 by 0.045 in. (PWA) and 0.07 by 0.07 in. (PWB), these series of thin-film wire-bondable resistor chips include power ratings up to 500 mW and 1 W, respectively. The PWA chips are available in values from 0.3 Ω to 1 MΩ, and the PWB chips come in values of 0.3 Ω to 20 kΩ. Both feature an oxidized silicon substrate, a self-passivating tantalum-nitride resistor material, and operate from −55°C to 125°C. Wire-bondable aluminum or gold pads are available. The resistors are 100% electrically tested and are visually inspected to meet MIL-PRF-38534 standards. Samples and production quantities are available now, with larger quantities in up to eight weeks.

Vishay Intertechnology Inc.www.vishay.com; (401) 738-9150, ext. 131

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.