Laser diodes, CPUs, and a host of other devices can be kept running cool with an assembly consisting of a heat pump, heatsink and fan. Heat from a device is transmitted from the pump to the sink and then to the ambient air via the fan. The assemblies come in a range of sizes (from 1.5" x 1.5" x 1" to 6" x 4" x 3") and in cooling capacities of from 5W to 30W.
Company: ACK TECHNOLOGY INC.
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