Low-Profile Hook-On EMI Gaskets Suit Bidirectional Applications

Feb. 18, 2002
A new line of low-profile, copper beryllum EMI shielding is designed for low-profile, bidirectional applications, such as rack-mounted linecards in telecommunications equipment. The gaskets offer high shielding effectiveness in situations where space...

A new line of low-profile, copper beryllum EMI shielding is designed for low-profile, bidirectional applications, such as rack-mounted linecards in telecommunications equipment. The gaskets offer high shielding effectiveness in situations where space is limited.

The gaskets install by simply hooking one end to the edge of the enclosure housing. The other end of the gasket features a teardrop profile to improve surface contact. It is secured by pressure-sensitive adhesive with extra-wide release liner. The result is secure retention with no-snag bidirectional wiping action. The gaskets are available in UltraSoft low-force versions and a wide variety of plating finishes to provide galvanic compatibility. Supplied in standard lengths of 16.2 in., they can also be cut to custom lengths.

For pricing and availability information about the IEEE-1394 connector gaskets, contact the company.

Laird Technologies
(570) 424-8510; www.lairdtech.com

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