Leadframe Memory Cards Slash Packaging Cost

Feb. 17, 2003

Aimed at memory die for digital storage and I/O applications, leadframe-based memory cards cut packaging costs by as much as 50% over conventional laminate-based solutions. Proprietary processes developed at Amkor Inc. brought the cards to fruition....

Roger Allan

"The process of using a leadframe structure is more challenging to solve than the more costly and common laminate process," explains Jeff Miks, Amkor's Memory Card product manager. "We're the first to solve it."

The processes can create both lidded and nonlidded memory cards in a fully molded configuration for MultiMedia Card and SecureDigital Card (MMC/SDC) formats. Lidded leadframe cards use an established automated process, which deposits adhesive material on the card housing (lid) and then attaches it to the die assembly with placement accuracy of 0.5 mil. Fully molded leadframe cards use the MMC/SDC-compliant form, without a separate lid assembly. In either case, the leadframe of the die assembly has the seven/nine-pin connector that corresponds with the connector in the end-use application. Over-molded die assembly for either the lidded or fully molded MMC/SDC typically include memory, passives, and a microcontroller.

MMCs are assembled to a standard 24- by 32- by 1.4-mm form factor, while SDCs are produced on a 24- by 32- by 2.1-mm form factor. Memory capacity depends on the design of the silicon die inserted into the memory card but typically holds 16 or 32 Mbytes. Stacking multiple memory chips into the card boosts this capacity to 128 Mbytes without increasing card dimensions. Cost depends on the number of memory die the customer uses.

Amkor Inc.
www.amkor.com
(480) 821-2408

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About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.