Pressure-Sensor System Is A Mini Medical Marvel

Dec. 1, 2008
The medical industry needed an implantable pressure- sensing system that had to meet very harsh requirements. Its must-haves included ultra-miniature size, wireless operation, the lowest power consumption for battery operation, precision low d

The medical industry needed an implantable pressure- sensing system that had to meet very harsh requirements. Its must-haves included ultra-miniature size, wireless operation, the lowest power consumption for battery operation, precision low drift and temperature stability, and isolation from media such as blood, tissue, and saline solutions.

Such were the very difficult challenges that Tronics Microsystems met with a two-chip microelectromechanical system (MEMS) solution. In fact, the customer’s requirements were so tough that no one could meet them until Tronics stepped in. The system was discussed at this year’s Sensors Expo (see “MEMS Motion Sensors Lead The Way At Sensors Expo 2008” at www.electronicdesign.com, ED Online 19242).

SENSOR, ASIC TEAM UP The solution consisted of a capacitive pressure sensor that measures about 1 mm2 and a companion high-resolution, signal-conditioning ASIC that has a wireless interface (Fig. 1). According to Tronics’ Ariel Cao, U.S. director for business development, “This solution is the smallest form-factor design for implantation in the body and other medical devices like leads and catheters.” Both of the chips are attached to a header that’s part of a hermetically sealed biocompatible titanium cylinder (Fig. 2).

The packaged pressure sensor fits within medical French catheter sizes of 11 by 21 and operates over a typical pressure range of 500 to 1000 mm of mercury (Hg) (700 to 1300 mbars) with an accuracy of ±0.75 Hg (1 mbar). It features low drift of ±1 mm Hg/year (1.2 mbars/year), samples at 100-Hz rates, and operates from 35°C to 42°C.

The device’s sensing element consists of reliable singlecrystal membranes with a customizable range and form factor to fit into square medical structures as well as needles. Three different pressure ranges are available to cover 0 to 200 bars of pressure.

A PIVOTAL ASIC Key to the design’s success, the ASIC chip includes a highresolution, 16-bit, sigma-delta modulator that directly converts capacitance changes to digital signals and provides compensation for nonlinearities and temperature changes (Fig. 3). Compensation calibration is performed with nine coefficients using matrix-based correction. This chip can also be customized to meet different form-factor requirements.

The ASIC features an integrated temperature gauge with 0.1°C resolution and 0.3°C accuracy from 0°C to 80°C. An EEPROM stores nonlinearity and temperature coefficients and produces 64 bits of unique ID information. The ASIC can be interfaced to standard I2C and serial-parallel interface (SPI) ports over a single wire.

The chip also includes the RF transceiver circuitry and power- supply management circuitry. RF data is transmitted using Manchester and one-out-of-four protocols via an ISO15693- based RF transponder interface.

To meet long-term biocompatibility requirements, the chip uses a titanium package. Incorporation of non-ferromagnetic materials helps with magnetic-resonant-imaging (MRI) procedure compliance. The packaged sensor is compatible with common sterilization procedures.

For further information, visit Tronics Microsystems’ Web site at www.tronics.com.

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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