Components: 56-Channel Module Links Up To 896 Thermocouples To Mainframe

Nov. 24, 2003

By using the DBK90 series of high-density thermocouple (TC) input modules for the DaqBook/2000 and WaveBook/516E Ethernet-based data-acquisition systems, up to 896 TCs can be attached to one analog-digital mainframe. Multiple mainframes may be combined for a maximum of 3584 TCs. Any combination of TC types can be attached to any channel via mini-TC input connectors. Each bank of 14 TC inputs has a separate cold-junction sensor to ensure accurate readings. It takes 1 ms/channel to make a TC measurement. All DBK90s come in an all-metal package that can be mounted on the mainframe or rack-mounted using an optional kit. Pricing is $1495 for 56 channels, and delivery is within four weeks.

IOtech Inc.www.iotech.com; (440) 439-4091

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.