Components: 44-Pin Test Plug Can Be Used With Plastic-Leaded-Chip-Carrier Sockets

Oct. 4, 2004
By enabling a cable to be soldered directly, or a socket or header on the topside, a novel plug offers customers three choices of connection. The 44-301695-XX 44-pin test plug is constructed of a 0.62-in. thick glass-filled FR-4 material with 1 oz of...

By enabling a cable to be soldered directly, or a socket or header on the topside, a novel plug offers customers three choices of connection. The 44-301695-XX 44-pin test plug is constructed of a 0.62-in. thick glass-filled FR-4 material with 1 oz of copper traces. It meets UL94V-0 specifications. Male pins are brass alloy 360 with 200-µP>in. of tin over 100 µin. of nickel per QQ-N-20 specifications. The socket version pins are made of a phosphor bronze alloy per QQ-B-750 specifications. The plug is available in custom materials, platings, sizes, and configurations. It costs $45 each, with delivery in three weeks.

Aries Electronics Inc.www.arieselec.com;
(908) 996-6841

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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