Components: SMT Three-Terminal Capacitor Sports Low ESL Characteristics

Dec. 16, 2004
A modified electrode structure improves high-frequency filtering performance in the FNM18PS size 0603 surface-mount (SMT) ceramic three-terminal capacitor. It does so by providing 50 to 70 dB of insertion loss from 200 MHz to 1 GHz. The capacitor's...

A modified electrode structure improves high-frequency filtering performance in the FNM18PS size 0603 surface-mount (SMT) ceramic three-terminal capacitor. It does so by providing 50 to 70 dB of insertion loss from 200 MHz to 1 GHz. The capacitor's main circuit application involves decoupling on the power line of high-speed ICs, whose higher operating frequencies create electromagnetic-interference (EMI) issues. Key applications include digital electronic equipment such as DVDs, mobile phones, and digital TVs. Samples are available at $0.11 each, and lead time is six to eight weeks.

Murata Electronicswww.murata.com; (770) 433-5782

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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