Nano-Imprint Lithography To The Rescue

Aug. 4, 2005
Nano-imprint lithography (NIL), a polymer stamping process, looms as the next revolutionary way to get past the limitations of conventional photolithography. Although this technology is still in its infancy, promising laboratory developments have emerge

Nano-imprint lithography (NIL), a polymer stamping process, looms as the next revolutionary way to get past the limitations of conventional photolithography. Although this technology is still in its infancy, promising laboratory developments have emerged for creating NIL devices (see the table).

The technology allows the low-cost creation of chips with feature sizes ranging from 20 to 100 nm on 4-in. silicon wafers. It also can make structures with high aspect ratios ranging from 1 to 80, which is beneficial for microfluidics, micro-optics, and other nanostructures.

NIL is part of a number of micro and nano patterning technologies that include hot embossing, ultraviolet (UV) embossing, and injection molding. The technology promises devices at one-tenth the cost of photolithography, but it still requires the development of production-ready tools and a manufacturing infrastructure.

The technology must develop higher-quality molds or templates, more precise alignment tools, and greater chip-defect control to be more successful. Many traditional semiconductor vendors are still skeptical about NIL's future, viewing it as an immature technology that may never fly. But don't tell that to its proponents.

Stan Williams, senior fellow and director of quantum research at Hewlett-Packard's laboratories, routinely makes experimental devices with 30-nm feature sizes using NIL, and HP isn't alone. EV Group, Molecular Imprints, Nanonex, Obducat, and Suss MicroTec are also involved with NIL technology. In fact, EV Group recently organized the NIL.com Consortium to push for the commercialization of NIL technology. The consortium includes universities, research institutes, and commercial companies.

The technology's importance can be seen from the fact that it's mentioned in the International Technology Roadmap for Semiconductors (ITRS). This joint planning report from the chip industry details technologies likely to become winners in chip manufacturing.

For cost-effective NIL, Jun-ho Jeong of the Korea Institute of Machinery and Materials proposes a UV-based NIL approach in which an element-wise patterned stamp (EPS) is used in low-vacuum or atmospheric environments (see the figure). He believes that this approach has two major advantages over other lithographic techniques: low cost and high resolution.

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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