Miniature Crystals Withstand Reflow Soldering Conditions

March 1, 1999
Housed in a 5 x 3.2 mm package are two new miniature crystals- the CX532 and CX45- both of which are designed to withstand reflow-soldering conditions. The CX532 has a height of 1.3 mm and has two industry-standard solder pad contacts. The CX45 stands

Housed in a 5 x 3.2 mm package are two new miniature crystals- the CX532 and CX45- both of which are designed to withstand reflow-soldering conditions. The CX532 has a height of 1.3 mm and has two industry-standard solder pad contacts. The CX45 stands just 0.95 mm with four standard solder pad contacts. Frequency range is from 20 MHz to 47 MHz. The crystal operates with a maximum drive level of 0.5 mW and a typical spec of 100 µW. Stability and tolerance specs are as low as ±30 ppm. Both crystals are designed for applications such as PCS, PCMCIA, and portable computing.

Company: CARDINAL COMPONENTS INC.

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