Since the "Quick-Release" backing of the firm's double-sided, pressure-sensitive tape is slightly wider than the adhesive layer, it is both simple and fast to remove, thereby speeding up installation of the RFI/EMI shielding. The tape is available with firm's low-profile beryllium copper gasket, which is just 0.06" tall and 0.28" wide. The durable gasket provides RFI/EMI shielding to 100 dB attenuation levels and is well-suited for bi-directional applications. Smooth to the touch, the stick-on gasket requires only a low closing force to close gaps as small as 0.02".
Company: TECH-ETCH INC.
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