This family of lead-frame packages has been extended to include dual-sided units. Said to combine the performance of array packages with the lower cost of lead frames, the dual, fine-pitch, no-lead (DFN) and enhanced, DFN+ packages target products such as cell phones, portable computers, PDAs, and automotive systems. The DFN+ package allows users to integrate passive components on two sides of the lead frame. With mounted profiles of either 0.75 or 0.9 mm, both packages eliminate the use of gull-wing leads and employ an exposed die pad that provides a thermal path for heat removal. The packages support Japanese requirements for pre-plated lead-frames and lead-free soldering. Manufactured using matrix array package (MAP) technology, the packages include a laser-marked identity on each strip that allows the auto-line to download process instructions and to offload to the blinded MAP devices. ADVANCED INTERCONNECT TECHNOLOGIES INC., Pleasanton, CA. (925) 426-3100.
Company: ADVANCED INTERCONNECT TECHNOLOGIES INC.
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