Electronicdesign 4781 Xl designfaq4 150x155 1

Ceramics For High-Power Packages

July 26, 2011
Newer power RF semiconductor technologies are enabling higher power levels in smaller device sizes, making packaging materials a real concern. Beryllium oxide (BeO), aluminum nitride (AlN), and alumina (Al2O3) are good thermal conductors, and BeO has long been the ceramic of choice for microelectronics packages through about 4 GHz.

Modern high-power RF semiconductors produce extremely high power densities, calling for packing materials with excellent thermal qualities to effectively dissipate the heat. Learn how to sort through different high-power package materials and how beryllium oxide (BeO) compares to other package material options.

Download the PDF here.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!