Packaging & Materials: Fan Tray Assemblies Support Up To Nine Fans

July 5, 2004

Three new fan tray assemblies can handle three, six, and nine fans per tray, putting out a total of more than 100 CFM of cooling per fan. Each assembly has a standard EIA size of 19.00 in by 1U (1.75 in.) notch for panel mounting, with depths of 7.00 to 17.25 in. Fan tray assemblies require no customer assembly and feature UL- and CSA-approved motors for 115-V ac, 60-Hz operation. Six- and nine-tray assemblies offer support-mounting brackets. Colors are standard black finish with an 84-in. long, three-prong power cord and a lighted on-off switch located on the front panel. Available from stock, they range in price from $120.45 to $337.45 each.

Bud Industries Inc. www.budind.com (440) 946-3200

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.