By co-extruding microscopic conductive traces through the interior sponge core of these RFI gaskets, conductors can be placed only where they are needed. The result is a cost-effective RFI shielding gasket that retains all of the silicone substrate
By co-extruding microscopic conductive traces through the interior sponge core of these RFI gaskets, conductors can be placed only where they are needed. The result is a cost-effective RFI shielding gasket that retains all of the silicone substrate characteristics. This approach makes the gaskets well suited for die-cut I/O panel applications.
