The company's Aluminum Silicon Carbide (AlSiC) metal matrix composite promises to be highly reliable and cost-effective for the housing, interconnection, and thermal management of microelectronic, optoelectronic, and power devices. RoHS compliant, AlSiC enables a tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies. Its isotropic CTE value is adjustable for specific applications by modifying the Al-metal/SiC-particulate ratio and CTE matching capabilities eliminate the need for thermal interface stacking. Other features include high thermal conductivity and a casting process that enables integration of very high thermal conductivity inserts, in excess of 1,000 W/mK, or cooling tubes for more complex thermal-management apps. CPS CORP., Norton, MA. (508) 222-0614.