High-Density IC Test Clips Cover A Variety Of Pin Counts

The DeltaProbe line of high-density test clips solves the complex problem of using test clips for quad flat pack (QFP), thin small-outline package (TSOP), small-outline IC (SO), and other fine-pitch IC packages. The line covers several pin counts, ranging from 48 to 240 pins. Over 25 different configurations are available.

DeltaProbe's contact technology, an array of wedge-shaped conductors that make contact by penetrating between the IC legs while ignoring the package body, enables the test clips to function for packages with slight variations from vendor specifications. The clips are available for QFPs in pin counts from 44 to 240 and in pitches from 1.27 down to 0.5 mm. They are available for TSOP Type II packages in pin counts of 50 and 54 with a lead pitch of 0.8 mm.

Single-quantity prices start at $525.

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