Packaging, Materials & Interconnects: Miniature Alumina Ceramic Parts Suit Demanding Applications

Nov. 15, 2004

Innovative dry-pressed alumina ceramic components are available for cost-effective solutions in the medical, consumer, telecom, aerospace, and semiconductor markets. They come in outer dimensions ranging from 0.02 to 2 in. and can be processed using the company's proprietary multicavity high-volume manufacturing process for orders in millions of parts. As a result, additional cost savings are possible. Each part is unique, so price depends on the type of part needed and its shape and dimensions. Lead time is from five to six weeks for existing tooling and 10 to 12 weeks for new tooling.

Morgan Technical Ceramics Inc.[email protected] (800) 433-0638

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.