Designed for PBGA, flex BGA, and die-to-die applications, the ABLEBOND 2025 series of electrically insulating die-attach adhesives offer to 260°C IR reliability for lead-free packaging assembly. The adhesives promise low moisture absorption, high hot-and-wet adhesion, low stress, and the ability to be snap cured. For further information and prices, call ABLESTIK, Rancho Dominguez, CA.
Company: ABLESTIK
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