Packaging/Interconnects: Classic 6U Backplanes Designed For VME64X Applications

Nov. 10, 2003
The Classic 6U VME64X series of backplanes, which complement the company's existing 7U VME64X line, features power taps for 3.3, 5, ±12 V, and GND above and below the slots. This enables the backplane to remain in a 6U height for...

The Classic 6U VME64X series of backplanes, which complement the company's existing 7U VME64X line, features power taps for 3.3, 5, ±12 V, and GND above and below the slots. This enables the backplane to remain in a 6U height for restricted-size applications. The 7U line has an extra 1U of height for more power bugs, located at the bottom of the backplane for cabling ease. In a side-to-side air-flow chassis, the 7U backplane can also act as an air baffle to redirect and optimize airflow. The 6U line will be initially offered in eight, 12, and 21 slots. Pricing for the 6U line starts under $1000 with two- to four-week delivery.

Bustronic Corp.www.bustronic.com; (510) 490-7388

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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