Electronicdesign Com Products Components Sockets For Bga Packages Feature Low Insertion Los

Sockets For BGA Packages Feature Low Insertion Loss

Oct. 8, 2008
Designed for the STMicroelectronics 35-mm and 27-mm package sizes, the SG-BGA-6245 and SG-BGA-6246 sockets operate at bandwidths up to 8 GHz with less than 1-dB insertion loss. The sockets dissipate up to 4.5 W at 40°C and can handle up to 100 W

Designed for the STMicroelectronics 35-mm and 27-mm package sizes, the SG-BGA-6245 and SG-BGA-6246 sockets operate at bandwidths up to 8 GHz with less than 1-dB insertion loss. The sockets dissipate up to 4.5 W at 40°C and can handle up to 100 W with an enhanced heat sink. Contact resistance is typically 23 mO per pin. The socket requires only 2.5 mm clearance around the chip, so discrete components can be placed near the IC. The sockets are constructed of high-performance and low-inductance elastomer and feature an operating temperature range of –35°C to 100°C. Pin inductance is 10.15 nH, and capacitance to ground is 0.10 pF. The SG-BGA-6245 accommodates 35-mm BGA packages with a 34 x 34 array and 1156 balls. The SG-BGA-6246 accommodates 27-mm BGA packages with a 26 x 26 array and 676 balls. The SG-BGA-6245 costs $1,020, and the SG-BGA-6246 is $738 in single-unit quantities. Volume discounts are available. IRONWOOD ELECTRONICS, Burnsville, MN. (800) 404-0204.

Company: IRONWOOD ELECTRONICS

Product URL: Click here for more information

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