Green Flip-Chip SOIC Package Qualified For Production Use

July 5, 2004

High-reliability packages, always in demand within the automotive, medical, and RF fields, are now going green. A fully qualified flip-chip small-outline IC (FC-SOIC) narrow body package developed by Advanced Interconnect Technologies (AIT) meets today's OEM requirements of MSL Level 1, 260°C standards. It uses pillar-bumping technology from Advanpack Solutions PTE Ltd. (APS) with a complete green package material set solution.

The package complies with the European Commission, American Environmental Protection Agency, and Japan Electronic Industry Development ban on the use of lead, mercury cadmium hexavalent, chromium, PBB, and PBDE chemicals. Implementation of Europe's green requirements is expected in 2006.

After stress testing, the FC-SOIC package met all JEDEC requirements. So, it's a potential solution to the stringent requirements of the Japanese OEM market. Electrical and thermal performance are enhanced by using perimeter or flip-chip pads, which connect the IC to a copper substrate across a shorter path. The packaging doesn't require any precious metals, and it features sealed bond pads, alpha-particle protection, and higher-temperature tolerance for faster assembly and lower manufacturing costs. It's pin-to-pin compatible with existing customer designs.

FCOSL packages come in a small-outline IC (SOIC), thin shrink small-outline package (TSSOP), and quad flat package (xQFP) configurations. Manufactured at AIT's factory in Batam, Indonesia, they're ready for full production. Pricing is based on volume and configuration.

Advanced Interconnect Technologies www.aithome.com (408) 734-3222

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.