Tin/Copper Fabric Enhances Gasketing

Oct. 1, 1999
The firm's Flectron tin-over-copper metallized fabric and Foam-Tite EMI shielding gaskets are well suited for shielding applications in all kinds of electronic enclosures. Tin's galvanic properties make it more neutral, and hence less potentially

The firm's Flectron tin-over-copper metallized fabric and Foam-Tite EMI shielding gaskets are well suited for shielding applications in all kinds of electronic enclosures. Tin's galvanic properties make it more neutral, and hence less potentially corrosive, when placed in contact with the wide range of metals used in enclosure fabrication. It's also hoped that tin will prove less allergenic than some other metals used in fabric-over-foam gaskets. The Flectron fabric is bonded to a low-compression-force foam. The copper substrate of the fabric is said to provide excellent electrical characteristics. Engineering samples can be provided within 24 hours.

Company: ADVANCED PERFORMANCE MATERIALS INC. (APM)

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