Packaging & Interconnects: Lightweight, Rugged VXI Chassis Comes Packed With Power

Sept. 20, 2004

Rugged construction, high-power cooling modules, and RS-485 monitoring all are represented in the RHP 11-slot high-power VXI chassis. It's made from advanced laminate welded construction and lightweight materials. The C-size backplane features active automatic bus-grant and IACK jumpering; active termination; and 96-pin high-current DIN connectors. It also features a rear-plugging ac front end and either one or two plugging dc power modules (the 1460-kW RHP-1 and the 2.2-kW RHP-2, respectively). The ac input power factor is 0.99 with power-factor correction. Price for the RHP-1 starts at $11,245 (five-unit lots minimum), and lead time is eight to 10 weeks.

Tracewell Systemswww.tracewellsystems.com(800) 848-4525

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.