Material Fills Gaps To Cool Hot Surfaces

Aug. 1, 1999
ULTRAstick thermal interface material undergoes a phase change at 60°C, becoming a highly thermally conductive liquid that displaces air and fills voids in the contact area. As a result, it’s said to improve thermal performance as it

ULTRAstick thermal interface material undergoes a phase change at 60°C, becoming a highly thermally conductive liquid that displaces air and fills voids in the contact area. As a result, it’s said to improve thermal performance as it replaces messy and difficult-to-apply thermal greases for applications requiring heatsinks in digital and power electronic applications.A hand-held applicator makes it a snap for users to apply the solid, silicone-free material to both heat sinks and other component surfaces. The material’s heat transfer performance is consistent across a range of mounting pressures.

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